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| MCP1403/4/5 4.5A Dual High-Speed Power MOSFET Drivers Features * High Peak Output Current: 4.5A (typ.) * Low Shoot-Through/Cross-Conduction Current in Output Stage * Wide Input Supply Voltage Operating Range: - 4.5V to 18V * High Capacitive Load Drive Capability: - 2200 pF in 15 ns - 5600 pF in 34 ns * Short Delay Times: 40 ns (typ.) * Low Supply Current: - With Logic `1' Input - 1.0 mA (typ.) - With Logic `0' Input - 150 A (typ.) * Latch-Up Protected: Will Withstand 1.5A Reverse Current * Logic Input Will Withstand Negative Swing Up To 5V * Packages: 8-Pin SOIC, PDIP, 8-Pin 6x5 DFN, and 16-Pin SOIC General Description The MCP1403/4/5 are a family of dual-inverting, dualnon-inverting, or complimentary output drivers. They can delivery high peak currents of 4.5A typically into capacitive loads. These devices also feature low shootthrough current, matched rise/fall times and propagation delays. The MCP1403/4/5 drivers operate from a 4.5V to 18V single power supply and can easily charge and discharge 2200 pF gate capacitance in under 15 ns (typ). They provide low enough impedances in both the on and off states to ensure the MOSFETs intended state will not be affected, even by large transients. The input to the MCP1403/4/5 may be driven directly from either TTL or CMOS (3V to 18V). The MCP1403/4/5 dual-output 4.5A driver family is offered in both surface-mount and pin-through-hole packages with a -40oC to +125oC temperature rating. The low thermal resistance of the thermally enhanced DFN package allows for greater power dissipation capability for driving heavier capacitive or resistive loads. These devices are highly latch-up resistant under any conditions within their power and voltage ratings. They are not subject to damage when up to 5V of noise spiking (of either polarity) occurs on the ground pin. All terminals are fully protect against Electrostatic Discharge (ESD) up to 4 kV. Applications * * * * Switch Mode Power Supplies Pulse Transformer Drive Line Drivers Motor and Solenoid Drive Package Types MCP1404 8-Pin MCP1405 PDIP/SOIC MCP1403 NC IN A GND IN B 1 2 3 4 8 7 6 5 16-Pin SOIC NC IN A NC GND GND NC IN B NC 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 MCP1404 MCP1403 MCP1405 NC OUT A OUT A VDD VDD OUT B OUT B NC NC OUT A OUT A VDD VDD OUT B OUT B NC NC OUT A OUT A VDD VDD OUT B OUT B NC NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B 8-Pin NC 1 IN A 2 GND 3 IN B 4 DFN(2) 8 7 6 5 MCP1404 MCP1403 MCP1405 NC OUT A VDD OUT B NC OUT A VDD OUT B NC OUT A VDD OUT B Note 1: Duplicate pins must both be connected for proper operation. 2: Exposed pad of the DFN package is electrically isolated. (c) 2007 Microchip Technology Inc. DS22022B-page 1 MCP1403/4/5 Functional Block Diagram (1) Inverting 730 A 300 mV Output VDD Input Effective Input C = 20 pF (Each Input) GND 4.7V Non-inverting MCP1403 Dual Inverting MCP1404 Dual Non-inverting MCP1405 Inverting / Non-inverting Note 1: Unused inputs should be grounded. DS22022B-page 2 (c) 2007 Microchip Technology Inc. MCP1403/4/5 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings Supply Voltage ................................................................+20V Input Voltage ............................... (VDD + 0.3V) to (GND - 5V) Input Current (VIN>VDD)................................................50 mA DC CHARACTERISTICS (NOTE 2) Electrical Specifications: Unless otherwise indicated, TA = +25C, with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Input Voltage Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Supply Voltage Power Supply Current Note 1: 2: VDD IS IS 4.5 -- -- -- 1.0 0.15 18.0 2.0 0.25 V mA mA VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) tR tF tD1 tD2 -- -- -- -- 15 18 40 40 28 28 48 48 ns ns ns ns Figure 4-1, Figure 4-2 CL = 2200 pF Figure 4-1, Figure 4-2 CL = 2200 pF Figure 4-1, Figure 4-2 Figure 4-1, Figure 4-2 VOH VOL ROH ROL IPK IREV VDD - 0.025 -- -- -- -- -- -- -- 2.2 2.8 4.5 >1.5 -- 0.025 3.0 3.5 -- -- V V A A DC Test DC Test IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VDD = 18V (Note 2) Duty cycle 2%, t 300 sec. VIH VIL IIN VIN 2.4 -- -1 -5 1.5 1.3 -- -- -- 0.8 1 VDD+0.3 V V A V 0V VIN VDD Sym Min Typ Max Units Conditions Switching times ensured by design. Tested during characterization, not production tested. (c) 2007 Microchip Technology Inc. DS22022B-page 3 MCP1403/4/5 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Note 1: 2: IS -- -- 2.0 0.2 3.0 0.3 mA VIN = 3V (Both Inputs) VIN = 0V (Both Inputs) tR tF tD1 tD2 -- -- -- -- 25 25 50 50 40 40 65 65 ns ns ns ns Figure 4-1, Figure 4-2 CL = 2200 pF Figure 4-1, Figure 4-2 CL = 2200 pF Figure 4-1, Figure 4-2 Figure 4-1, Figure 4-2 VOH VOL ROH ROL VDD - 0.025 -- -- -- -- -- 3.1 3.7 -- 0.025 6.0 7 V V DC TEST DC TEST IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL IIN 2.4 -- -10 -- -- -- -- 0.8 +10 V V A 0V VIN VDD Sym Min Typ Max Units Conditions Switching times ensured by design. Tested during characterization, not production tested. TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Temperature Ranges Specified Temperature Range Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-PDIP Thermal Resistance, 8L-SOIC Thermal Resistance, 16L-SOIC JA JA JA JA -- -- -- -- 33.2 125 155 155 -- -- -- -- C/W C/W C/W C/W 4-Layer JC51-7 Standard Board, Natural Convection Typical four-layer board with vias to ground plane TA TJ TA -40 -- -65 -- -- -- +125 +150 +150 C C C Sym Min Typ Max Units Conditions DS22022B-page 4 (c) 2007 Microchip Technology Inc. MCP1403/4/5 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. 100 90 80 Rise Time (ns) 70 60 50 40 30 20 10 4 6 8 10 12 14 16 18 Supply Voltage (V) 1800 pF 6800 pF 100 90 Fall Time (ns) 4700 pF 2200 pF 6800 pF 4700 pF 2200 pF 80 70 60 50 40 30 20 10 4 6 1800 pF 8 10 12 14 16 18 Supply Voltage (V) FIGURE 2-1: Voltage. 80 70 Rise Time (ns) Rise Time vs. Supply FIGURE 2-4: Voltage. 100 90 80 Fall Time (ns) Fall Time vs. Supply 60 50 40 30 20 10 1000 Capacitive Load (pF) 18V 12V 5V 70 60 50 40 30 20 18V 5V 12V 10000 10 1000 Capacitive Load (pF) 10000 FIGURE 2-2: Load. 24 22 Time (ns) 20 18 16 14 12 -40 -25 -10 5 tRISE tFALL Rise Time vs. Capacitive FIGURE 2-5: Load. 160 Propagation Delay (ns) 135 110 85 60 tD2 Fall Time vs. Capacitive CLOAD = 1800 pF VDD = 12V CLOAD = 1800 pF tD1 35 20 35 50 65 80 95 110 125 Temperature ( C) o 2 3 4 5 6 7 8 9 10 Input Amplitude (V) FIGURE 2-3: Temperature. Rise and Fall Times vs. FIGURE 2-6: Amplitude. Propagation Delay vs. Input (c) 2007 Microchip Technology Inc. DS22022B-page 5 MCP1403/4/5 Typical Performance Curves (Continued) Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. 100 Propagation Delay (ns) 90 80 70 60 50 40 30 4 6 8 10 12 14 16 18 Supply Voltage (V) tD2 tD1 Quiescent Current (mA) CLOAD = 1800 pF 0.5 0.4 0.3 0.2 Both Inputs = 0 Both Inputs = 1 0.1 0 -40 -25 -10 5 20 35 50 65 80 95 110 125 Temperature ( C) o FIGURE 2-7: Supply Voltage. 70 Propagation Delay (ns) 65 60 55 50 45 40 35 30 -40 -25 -10 5 CLOAD = 1800 pF Propagation Delay Time vs. FIGURE 2-10: Temperature. 7 Quiescent Current vs. tD2 6 ) ROUT-HI ( : 5 4 3 2 1 TJ = +150oC VIN = 5V (MCP1404) VIN = 0V (MCP1403) tD1 TJ = +25oC 20 35 50 65 80 95 110 125 Temperature ( C) o 4 6 8 10 12 14 16 18 Supply Voltage (V) FIGURE 2-8: Temperature. 0.5 Quiescent Current (mA) 0.4 0.3 0.2 0.1 0 4 6 8 Both Inputs = 1 Propagation Delay Time vs. FIGURE 2-11: Output Resistance (Output High) vs. Supply Voltage. 8 7 ) ROUT-LO ( : 6 5 4 3 2 TJ = +25oC TJ = +150oC VIN = 0V (MCP1404) VIN = 5V (MCP1403) Both Inputs = 0 10 12 14 16 18 4 6 8 10 12 14 16 18 Supply Voltage (V) Supply Voltage (V) FIGURE 2-9: Supply Voltage. Quiescent Current vs. FIGURE 2-12: Output Resistance (Output Low) vs. Temperature. DS22022B-page 6 (c) 2007 Microchip Technology Inc. MCP1403/4/5 Typical Performance Curves (Continued) Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. 100 VDD = 18V 90 80 70 60 50 40 200 kHz 30 20 10 0 100 80 Supply Current (mA) 70 60 50 40 30 20 10 0 1000 Capacitive Load (pF) 10000 10 100 Frequency (kHz) 1000 100 pF 2,200 pF 650 kHz 400 kHz 50 kHz 100 kHz VDD = 18V 6,800 pF 4,700 pF FIGURE 2-13: Capacitive Load. 120 Supply Current (mA) 100 80 60 40 20 0 100 Supply Current (mA) Supply Current vs. FIGURE 2-16: Frequency. 140 Supply Current vs. VDD = 12V 2 MHz 100 kHz VDD = 12V 6,800 pF Supply Current (mA) 1 MHz 120 100 80 60 40 20 0 10 100 4,700 pF 2,200 pF 500 kHz 200 kHz 100 pF 1000 Capacitive Load (pF) 10000 1000 10000 Frequency (kHz) FIGURE 2-14: Capacitive Load. 120 Supply Current (mA) 100 80 60 40 20 0 100 500 kHz Supply Current vs. FIGURE 2-17: Frequency. 140 Supply Current vs. VDD = 6V 3.5 MHz 2 MHz 200 kHz 1 MHz VDD = 6V Supply Current (mA) 120 100 80 60 40 20 0 10 100 6,800 pF 4,700 pF 2,200 pF 100 pF 1000 Capacitive Load (pF) 10000 1000 10000 Frequency (kHz) FIGURE 2-15: Capacitive Load. Supply Current vs. FIGURE 2-18: Frequency. Supply Current vs. (c) 2007 Microchip Technology Inc. DS22022B-page 7 MCP1403/4/5 Typical Performance Curves (Continued) Note: Unless otherwise indicated, TA = +25C with 4.5V VDD 18V. 1.00E-06 -6 Crossover Energy (A*sec) 10 1.00E-07 10 -7 1.00E-08 10 -8 1.00E-09 10 -9 4 6 8 10 12 14 16 18 Supply Voltage (V) Note: The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated value by 2. For a single transition of a single driver divide the stated value by 4. FIGURE 2-19: Supply Voltage. Crossover Energy vs. DS22022B-page 8 (c) 2007 Microchip Technology Inc. MCP1403/4/5 3.0 PIN DESCRIPTIONS PIN FUNCTION TABLE (1) 8-Pin DFN 1 2 -- 3 -- -- 4 -- -- 5 -- 6 -- 7 -- 8 PAD 16-Pin SOIC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 -- Symbol NC IN A NC GND GND NC IN B NC NC OUT B OUT B VDD VDD OUT A OUT A NC NC No Connection Control Input for Output A No Connection Ground Ground No Connection Control Input for Output B No Connection No Connection Output B Output B Supply Input Supply Input Output A Output A No Connection Exposed Metal Pad Description The descriptions of the pins are listed in Table 3-1. TABLE 3-1: 8-Pin PDIP SOIC 1 2 -- 3 -- -- 4 -- -- 5 -- 6 -- 7 -- 8 -- Note 1: Duplicate pins must be connected for proper operation. 3.1 Supply Input (VDD) 3.4 Outputs A and B VDD is the bias supply input for the MOSFET driver and has a voltage range of 4.5V to 18V. This input must be decoupled to ground with a local capacitor. This bypass capacitor provides a localized low-impedance path for the peak currents that are to be provided to the load. 3.2 Control Inputs A and B Outputs A and B are CMOS push-pull output that is capable of sourcing and sinking 4.5A of peak current (VDD = 18V). The low output impedance ensures the gate of the external MOSFET will stay in the intended state even during large transients. These output also has a reverse current latch-up rating of 1.5A. The MOSFET driver input is a high-impedance, TTL/ CMOS-compatible input. The input also has hysteresis between the high and low input levels, allowing them to be driven from slow rising and falling signals, and to provide noise immunity. 3.5 Exposed Metal Pad The exposed metal pad of the DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board to aid in heat removal from the package. 3.3 Ground (GND) Ground is the device return pin. The ground pin should have a low impedance connection to the bias supply source return. High peak currents will flow out the ground pin when the capacitive load is being discharged. (c) 2007 Microchip Technology Inc. DS22022B-page 9 MCP1403/4/5 4.0 4.1 APPLICATION INFORMATION General Information VDD = 18V 1 F 0.1 F Ceramic MOSFET drivers are high-speed, high current devices which are intended to source/sink high peak currents to charge/discharge the gate capacitance of external MOSFETs or IGBTs. In high frequency switching power supplies, the PWM controller may not have the drive capability to directly drive the power MOSFET. A MOSFET driver like the MCP1403/4/5 family can be used to provide additional source/sink current capability. Input Input MCP1404 (1/2 MCP1405) Output CL = 2200 pF 4.2 MOSFET Driver Timing The ability of a MOSFET driver to transition from a fully off state to a fully on state are characterized by the drivers rise time (tR), fall time (tF), and propagation delays (tD1 and tD2). The MCP1403/4/5 family of drivers can typically charge and discharge a 2200 pF load capacitance in 15 ns along with a typical matched propagation delay of 40 ns. Figure 4-1 and Figure 4-2 show the test circuit and timing waveform used to verify the MCP1403/4/5 timing. VDD = 18V 1 F 0.1 F Ceramic +5V Input 0V 18V Output 0V 10% 10% tD1 90% 90% tR tD2 90% tF 10% FIGURE 4-2: Waveform. Non-Inverting Driver Timing Input Output CL = 2200 pF 4.3 Decoupling Capacitors Input MCP1403 (1/2 MCP1405) Careful layout and decoupling capacitors are highly recommended when using MOSFET drivers. Large currents are required to charge and discharge capacitive loads quickly. For example, 2.5A are needed to charge a 2200 pF load with 18V in 16 ns. To operate the MOSFET driver over a wide frequency range with low supply impedance a ceramic and low ESR film capacitor are recommended to be placed in parallel between the driver VDD and GND. A 1.0 F low ESR film capacitor and a 0.1 F ceramic capacitor placed between VDD and GND pins should be used. These capacitors should be placed close to the driver to minimized circuit board parasitics and provide a local source for the required current. +5V Input 0V 18V Output 0V 10% tD1 90% 10% 90% tF tD2 tR 90% 10% 4.4 PCB Layout Considerations FIGURE 4-1: Waveform. Inverting Driver Timing Proper PCB layout is important in a high current, fast switching circuit to provide proper device operation and robustness of design. PCB trace loop area and inductance should be minimized by the use of ground planes or trace under MOSFET gate drive signals, separate analog and power grounds, and local driver decoupling. DS22022B-page 10 (c) 2007 Microchip Technology Inc. MCP1403/4/5 Placing a ground plane beneath the MCP1403/4/5 will help as a radiated noise shield as well as providing some heat sinking for power dissipated within the device. 4.5.2 QUIESCENT POWER DISSIPATION 4.5 Power Dissipation The total internal power dissipation in a MOSFET driver is the summation of three separate power dissipation elements. The power dissipation associated with the quiescent current draw depends upon the state of the input pin. The MCP1403/4/5 devices have a quiescent current draw when both inputs are high of 1.0 mA (typ) and 0.15 mA (typ) when both inputs are low. The quiescent power dissipation is: P Q = ( I QH x D + I QL x ( 1 - D ) ) x V DD Where: IQH = Quiescent current in the high state D = Duty cycle IQL = Quiescent current in the low state VDD = MOSFET driver supply voltage P T = P L + P Q + P CC Where: PT = Total power dissipation PL = Load power dissipation PQ = Quiescent power dissipation PCC = Operating power dissipation 4.5.3 OPERATING POWER DISSIPATION 4.5.1 CAPACITIVE LOAD DISSIPATION The power dissipation caused by a capacitive load is a direct function of frequency, total capacitive load, and supply voltage. The power lost in the MOSFET driver for a complete charging and discharging cycle of a MOSFET is: The operating power dissipation occurs each time the MOSFET driver output transitions because for a very short period of time both MOSFETs in the output stage are on simultaneously. This cross-conduction current leads to a power dissipation describes as: P CC = CC x f x V DD Where: CC = Cross-conduction constant (A*sec) f = Switching frequency VDD = MOSFET driver supply voltage P L = f x C T x V DD Where: f = Switching frequency CT = Total load capacitance 2 VDD = MOSFET driver supply voltage (c) 2007 Microchip Technology Inc. DS22022B-page 11 MCP1403/4/5 5.0 5.1 PACKAGING INFORMATION Package Marking Information (Not to Scale) 8-Lead DFN Example: XXXXXXX XXXXXXX XXYYWW NNN MCP1403 e3 E/MF^^ 0648 256 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW Example: MCP1403 e3 E/P^^256 0648 8-Lead SOIC (150 mil) XXXXXXXX XXXXYYWW NNN Example: MCP1405E SN^^0648 e3 256 16-Lead SOIC (300 mil) Example: XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX YYWWNNN MCP1405 e3 E/SO^^ 0648256 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. DS22022B-page 12 (c) 2007 Microchip Technology Inc. MCP1403/4/5 8-Lead Plastic Dual Flat, No Lead Package (MF) - 6x5 mm Body [DFN-S] PUNCH SINGULATED Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D D1 N b e N K L E E1 EXPOSED PAD NOTE 1 1 2 TOP VIEW 2 D2 BOTTOM VIEW 1 E2 NOTE 1 A A1 A2 A3 NOTE 2 Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Base Thickness Overall Length Molded Package Length Exposed Pad Length Overall Width Molded Package Width Exposed Pad Width Contact Width Contact Length Contact-to-Exposed Pad Model Draft Angle Top N e A A2 A1 A3 D D1 D2 E E1 E2 b L K 2.16 0.35 0.50 0.20 - 3.85 - - 0.00 MIN MILLIMETERS NOM 8 1.27 BSC 0.85 0.65 0.01 0.20 REF 4.92 BSC 4.67 BSC 4.00 5.99 BSC 5.74 BSC 2.31 0.40 0.60 - - 2.46 0.47 0.75 - 12 4.15 1.00 0.80 0.05 MAX Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package may have one or more exposed tie bars at ends. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-113B (c) 2007 Microchip Technology Inc. DS22022B-page 13 MCP1403/4/5 8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging N NOTE 1 E1 1 2 D 3 E A2 A A1 e b1 b L c eB Units Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing N e A A2 A1 E E1 D L c b1 b eB - .115 .015 .290 .240 .348 .115 .008 .040 .014 - MIN INCHES NOM 8 .100 BSC - .130 - .310 .250 .365 .130 .010 .060 .018 - .210 .195 - .325 .280 .400 .150 .015 .070 .022 MAX .430 Notes: 1. Pin 1 visual index feature may vary, but must be located with the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-018B DS22022B-page 14 (c) 2007 Microchip Technology Inc. MCP1403/4/5 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e N E E1 NOTE 1 1 2 3 b h c h A A2 A1 L L1 Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom N e A A2 A1 E E1 D h L L1 c b 0 0.17 0.31 5 5 0.25 0.40 - 1.25 0.10 MIN MILLIMETERS NOM 8 1.27 BSC - - - 6.00 BSC 3.90 BSC 4.90 BSC - - 1.04 REF - - - - - 8 0.25 0.51 15 0.50 1.27 1.75 - 0.25 MAX 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-057B (c) 2007 Microchip Technology Inc. DS22022B-page 15 MCP1403/4/5 16-Lead Plastic Small Outline (SO) - Wide, 7.50 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D N E E1 NOTE 1 1 23 b h A A2 c e h L A1 L1 Units Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer (optional) Foot Length Footprint Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom N e A A2 A1 E E1 D h L L1 c b 0 0.20 0.31 5 5 0.25 0.40 - 2.05 0.10 MIN MILLIMETERS NOM 16 1.27 BSC - - - 10.30 BSC 7.50 BSC 10.30 BSC - - 1.40 REF - - - - - 8 0.33 0.51 15 0.75 1.27 2.65 - 0.30 MAX 15 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-102B DS22022B-page 16 (c) 2007 Microchip Technology Inc. MCP1403/4/5 APPENDIX A: REVISION HISTORY Revision B (May 2007) * * * * * * Page 13: Updated Package Outline Drawing Page 14: Updated Package Outline Drawing Page 15: Updated Package Outline Drawing Page 16: Updated Package Outline Drawing Page 17: Updated Revision History Page 19: Corrected Package Codes in Product Identification System Revision A (December 2006) * Original Release of this Document. (c) 2007 Microchip Technology Inc. DS22022B-page 17 MCP1403/4/5 NOTES: DS22022B-page 18 (c) 2007 Microchip Technology Inc. MCP1403/4/5 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package Examples: a) MCP1403-E/SN: 4.5A Dual Inverting MOSFET Driver, 8LD SOIC package. MCP1403-E/P: 4.5A Dual Inverting MOSFET Driver, 8LD PDIP package. MCP1403-E/MF: 4.5A Dual Inverting MOSFET Driver, 8LD DFN package. MCP1403-E/SO: 4.5A Dual Inverting MOSFET Driver, 16LD SOIC package. b) Device: MCP1403: 4.5A Dual MOSFET Driver, Inverting MCP1403T: 4.5A Dual MOSFET Driver, Inverting (Tape and Reel) MCP1404: 4.5A Dual MOSFET Driver, Non-Inverting MCP1404T: 4.5A Dual MOSFET Driver, Non-Inverting (Tape and Reel) MCP1405: 4.5A Dual MOSFET Driver, Complementary MCP1405T: 4.5A Dual MOSFET Driver, Complementary (Tape and Reel) E MF P SN SO = = = = = -40C to +125C Dual, Flat, No-Lead (6x5 mm Body), 8-lead Plastic DIP, (300 mil body), 8-lead Plastic SOIC (150 mil Body), 8-Lead Plastic SOIC (Wide), 16-Lead c) d) Temperature Range: Package: * a) b) MCP1404T-E/SN: Tape and Reel. 4.5A Dual Non-Inverting, MOSFET Driver, 8LD SOIC package, MCP1404-E/P: 4.5A Dual Non-Inverting, MOSFET Driver, 8LD PDIP package. MCP1405-E/SN: 4.5A Dual Complementary, MOSFET Driver, 8LD SOIC package. MCP1405-E/P: 4.5A Dual Complementary, MOSFET Driver, 8LD PDIP package. MCP1405T-E/SO: Tape and Reel, 4.5A Dual Complementary MOSFET Driver, 16LD SOIC package. * All package offerings are Pb Free (Lead Free) a) b) c) (c) 2007 Microchip Technology Inc. DS22022B-page 19 MCP1403/4/5 NOTES: DS22022B-page 20 (c) 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2007 Microchip Technology Inc. DS22022B-page 21 WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256 ASIA/PACIFIC India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 12/08/06 DS22022B-page 22 (c) 2007 Microchip Technology Inc. |
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